Our Products and Services

ECRI Microelectronics is a leading supplier of microelectronic packages in China. Products include glass to metal packages, ceramic to metal packages and AL-SiC packages, etc. Now we supply more than 7 series, 400 varieties of packages with annual capacity of more than 1 million sets. The packages are used in hermetic sealing of Hybrid IC, optoelectronic devices, microwave devices, sensors and fuel-cell, etc.

Package baseplate materials: Kovar(4J29), CRS, OFHC, Tungsten Copper, Iron-Nickel Alloy (4J42), 316L, 304L and AL-SiC, etc.

Package Cap materials: Kovar (4J29) and Iron-Nickel Alloy (4J42), etc.

Package lead materials: Kovar (4J29), 4J50 and Copper-Core Alloy, etc.

We currently represent ECRI Microelectronics' following microelectronic package products in global markets. We will bring more products to you in the near future.

         •    Uni-Body Packages                                  •   Uni-Body Power Packages                         

         •   Flat Packages                                              •   Flat Power Packages

         •    Platform Packages                                     •    Fiber Optical Packages

        •   Special Style Packages

We have many Open Tool packages for your applications. Following are Open Tool package drawings for your reference - click package style to open PDF file.